Descriere

Quectel EG060V-EA Module is an LTE Advanced Cat 6 module optimized specially for M2M and IoT applications delivering maximum data rate of up to 300 Mbps downlink and 50 Mbps uplink in an LGA form factor.

Quectel EG060V-EA Module Product Overview

Quectel EG060V-EA Module is an LTE Advanced category 6 module optimized specially for M2M and IoT applications. The module is designed in an LGA form factor and reaches a maximum data rate of up to 300 Mbps downlink and 50 Mbps by adopting the 3GPP Release 10 LTE technology, it . it is compatible with Quectel Cat 6 module EG06 and Cat 12 module EG12. This compatibility facilitates migration between different categories. în plus, the rich Internet protocols, multiple interfaces, și funcționalități abundente (Drivere USB pentru Windows 7, Windows 8/8.1, Windows 10, WinCE, Linux și Android) make it widely applicable in the fields of M2M and IoT. The recommended applications are routers (including MiFis), gateway-uri de acasă, set-top box-uri, PDAs, tablet PCs, Supraveghere video, semnalizare digitala, and so on.

Quectel EG060V-EA Module Product Pictures

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Quectel EG060V-EA Module Product Specifications

For EMEA/APAC①/Brazil Funcții îmbunătățite Caracteristici generale
EG060V-EA MIMO: 2 × 2, 4 × 2, DL 3Lansare GPP E-UTRA 10 Compliance
LTE-FDD: B1/B3/B5/B7/B8/B20/B28 eCall: Emergency Service LGA Package
LTE-TDD: B38/B40/B41 Audio digital și VoLTE (Voce prin LTE) Lățimea de bandă: 1.4/3/5/10/15/20/40 (2 × CA) MHz
2 × CA②: B1 + B1/B3/B5/B8/B20/B28; (U)Detectarea cartelei SIM Gama de tensiune de alimentare: 3.3-4,3 V, tip. 3.8 V
B3 + B3/B5/B7/B8③/B20/B28; DTMF: Dual-tone Multi-frequency Operation Temperature Range: -20 °C până la +55 °C
B7 + B5/B7/B8/B20/B28; PICIOR: Firmware Upgrade Over-the-Air Interval extins de temperatură: -25 °C până la +60 °C
B38 + B38; B40 + B40; B41 + B41 Wi-Fi* Function through PCIe Interface Dimensiuni: 39.5 mm × 37.0 mm × 3.05 mm
WCDMA: B1/B5/B8 caracteristici electrice Greutate: aproximativ. 6.7 g
Date Putere de iesire: Comandamentul AT:
LTE: Clasă 3 (23 dBm ±2 dB) for LTE-FDD④ 3GPP TS 27.007
LTE-FDD: max. 300 Mbps (DL)/max. 50 Mbps (UL) Clasă 3 (23 dBm ±2 dB) pentru LTE-TDD Comenzi AT îmbunătățite Quectel
LTE-TDD: max. 220 Mbps (DL)/max. 30 Mbps (UL) Clasă 3 (24 dBm +1/-3 dB) pentru WCDMA Aprobari
UMTS: Consumul de energie: de reglementare:
HSDPA: max. 21 Mbps (DL) 10 μA @ Oprire CE (Europa)
HSUPA: max. 5.76 Mbps (UL) 3.7 mA @ Somn (PF = 128) NCC (Taiwan, China)
WCDMA: max. 384 kbps (DL)/max. 384 kbps (UL) 5.0 mA @ Somn (PF = 64) RCM (Australia/Noua Zeelandă)
SMS 30 mA @ Inactiv Note:
MO și MT punct la punct Caracteristici software 1. *: In dezvoltare
Difuzare celulară SMS Driver serial USB: 2. : Excluding Japan and China Mobile
Moduri text și PDU Windows 7/8/8.1/10 3. ②: 2 x CA supports continuous intra-band CA,
Interfețe WinCE 5.0/6.0/7.0*; but not non-continuous intra-band CA.
USB 2.0 × 1: Support Slave and Master* Modes Linux 2.6/3.x/4.1–4.14 4. : For CA-3A-8A, “B3 (PCC) + B8 (SCC)” is
(U)SIM × 1: 1.8/3.0 V Android 4.x/5.x/6.x/7.x/8.x supported, while “B8 (PCC) + B3 (SCC)” is not.
GPIO* × 2 USB NCM Driver: 5. : For LTE-FDD Band 3, the transmitting
UART × 2 Linux 2.6–5.14 power is 21.5 dBm ±1 dB.
PCIe (RC)*× 1: PCIe Gen 1, for Wi-Fi Function Sofer RIL:
SD Card Interface* × 1 Android 4.x–10.x
I2C × 1 Driver USB ECM:
PCM × 1 Linux 2.6–5.9
SPI × 1 RNDIS Driver:
ADC × 2 Windows 7/8/8.1/10
RESET_N: Resetați modulul Linux 2.6–5.9
Main and Diversity Antennas Protocoale:
PPP/TCP/UDP/FTP/FTPS/HTTP/HTTPS/NTP/PING/
SMTP*/MMS*/SMTPS*/SSL

Quectel EG060V-EA Module Product Features

  • Supports LTE-A carrier aggregation
  • Worldwide LTE-A and UMTS/HSPA(+) coverage
  • Rafinamente ale caracteristicilor: supports FOTA and DTMF
  • systems on data rate and link reliability
  • MIMO technology meets demands of wireless communication
  • LTE-A Cat 6 module with LGA form factor, optimizat pentru aplicații M2M și IoT

Quectel EG060V-EA Module and Related Models

EM06-J
EM06-A
EP06-E
EP06-A
EG06-E
EG06-A
EG06-AUTL
EG06-EA
EG060V-EA
EM060K-GL

Quectel EG060V-EA Module Product Applications

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