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Description
SIMCom SIM8300G-M2 5G Module is a Multi-Band 5G NR/LTE-FDD/LTE-TDD/HSPA+ module which supports R15 5G NSA/SA up to 7Gbps data transfer
SIMCom SIM8300G-M2 5G Module Product Overview
SIMCom SIM8300G-M2 5G Module has strong extension capability with abundant interfaces including PCIe, USB3.1, GPIO etc. and besides it offers much flexibility and ease of integration for customer’s applications.
SIM8300G-M2 uses M.2 form factor, TYPE 3052-D3-B. AT commands of SIM8300G-M2 are compatible with SIM7912G/SIM8200-M2 series modules. So this also minimizes the investments of customers and enables a short time-to-market.
SIMCom SIM8300G-M2 5G Module is designed for applications that requires high throughput data communication in a variety of radio propagation conditions. Due to the unique combination of performance, fiarovana sy fahafaha-manao, SIMCom SIM8300G-M2 5G Module is ideally fit for many applications.
SIMCom SIM8300G-M2 5G Module Product Picture
SIMCom SIM8300G-M2 5G Module Product Specifications
| Endri-javatra ankapobeny | NY FANAZAVANA |
| • Frequency Bands: | • mmWave |
| 5G mmWave: n257,n258,n260,n261 | ‐ Uplink up to 3 Gbps |
| 5G Sub-6G: n1,n2,n3,n5,n7,n8,n12,n20,n25,n28,n40,n41,n66,n71,n77,n78,n79 | ‐ Downlink up to 7 Gbps |
| LTE-FDD: B1/B2/B3/B4/B5/B7/B8/B12/B13/B14/B17/B18/B19/B20/B25/B26/B28/B29/B30/B66/B71 | • Sub‐6G |
| LTE-TDD: B34/B38/B39/B40/B41/B42/B46/B48 | ‐ Uplink up to 1 Gbps |
| WCDMA: B1/B2/B3/B4/B5/B8 | ‐ Downlink up to 4 Gbps |
| • Supply voltage range: 3.135V~ 4.4V | • LTE Cat20+ |
| • Control Via AT Commands | ‐ Uplink up to 200Mbps |
| • Operation temperature: -30℃ ~ +70 ℃ | ‐ Downlink up to 2 Gbps |
| • Dimensions: 52.0*30.0*3.65MG | • HSPA+ |
| • mmWave/Sub‐6G/LTE‐FDD/LTE‐TDD/WCDMA | ‐ Uplink up to 5.76Mbps |
| ‐ Downlink up to 42 Mbps | |
| Endri-javatra hafa | • Interfaces |
| • USB Driver for Microsoft Windows Win7/Win8/Win10 | • USB2.0 |
| • USB Driver for Linux /Android | • USB3.1 |
| • RIL supporting for Android 6.0/7.0/8.0/9.0 | • UART |
| • RNDIS /NDIS/PPP/MBIM to Win8 | • USIM (1.8V /2.95V) |
| • Firmware update via USB | • PCM |
| • TCP/IP/IPV4/IPV6/Multi‐PDP/FTP/FTPS /HTTP/HTTPS/MQTTS/DNS/SSL3.0/TLS1.0/TLS1.2 | • I2C |
| • DTMF (Sending and Receiving) | • GPIOs |
| • VoNR*/VoLTE/CSFB | • PCIe Gen3 |
| • FOTA | • Antenna x 14 |
| • RoHSREACHJATETelecCE(MENA)GCFFCCPTCRBIC |
SIMCom SIM8300G-M2 5G Module Product Features
- 5G mmWave: n257,n258,n260,n261
- 5G Sub-6G: n1,n2,n3,n5,n7,n8,n12,n20,n25,n28,n40,n41,n66,n71,n77,n78,n79
- B1/B2/B3/B4/B5/B7/B8/B12/B13/B14/B17/B18/B19/B20/B25/B26/B28/B29/B30/B66/B71
- LTE-TDD: B34/B38/B39/B40/B41/B42/B46/B48
- WCDMA: B1/B2/B3/B4/B5/B8
- Famatsiana isan-karazany: 3.135V~ 4.4V
- Uplink up to 3 Gbps Downlink up to 7 Gbps
- Uplink up to 1 Gbps Downlink up to 4 Gbps
- Uplink up to 200Mbps Downlink up to 2 Gbps
- Uplink up to 5.76Mbps Downlink up to 42 Mbps
- USB Driver for Microsoft Windows Win7/Win8/Win10
- USB Driver ho an'ny Linux / Android
- RIL manohana ny Android 6.0/7.0/8.0/9.0
- RNDIS /NDIS/PPP/MBIM to Win8
SIMCom SIM8300G-M2 5G Module and More 5G Modules
SIMCom SIM8300G-M2 5G Module Product Applications
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